The world’s most advanced silicon photonics technology
Luxtera is at the forefront of bringing Silicon Photonics into high volume manufacturing. We are the first company to scale silicon photonics transceivers to millions of units
Luxtera uses an innovative approach to optics through hybrid integration. The photonics die forms the base of the transceiver chipset, while the light source and electronics die are attached on top. This means we can optimize each process technology independently for the optical components, electronic components, and light source. Hybrid integration allows versatility, enabling Luxtera to bake in flexibility for our chipsets to suit a range of applications.
Wafer Scale Manufacturing
Our ability to integrate all optical components into a single silicon chip enables Luxtera to manufacture at wafer scale. This means that each component: photonics die, electronics die, and light source, can be tested and known good before and after attachment into a complete chipset, all before the wafer is diced. Because of this, Luxtera is able to achieve unprecedented levels of automation, yield, and scale in the optical transceiver industry.
Highly Automated Assembly
Luxtera is uniquely positioned to deliver transceivers with levels of quality and reliability that traditional optics vendors can’t match. A completed chipset passes through a series of highly-automated steps for precision fiber alignment and attach, module level assembly, and a full suite of functional testing.
Complete Transceiver in a Single Chipset
The end result of Luxtera’s continued advancement along the front edges of silicon photonics, high speed electronics design, and automated manufacturing is a transceiver contained entirely in a single chipset. It is a solution that makes possible the proliferation of high-bandwidth, low cost optical interconnects for our customers.