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Industry Pioneer Lanny Ross Joins Luxtera’s Board of Directors Carlsbad, Calif. October 3, 2006 – Luxtera Inc., a leading innovator in CMOS photonics, today announced that Lanny Ross has joined its Board of Directors. Ross brings with him an extraordinary amount of experience in the communications industry, most recently as President and CEO of Broadcom Corporation, where he continues to serve as a member of its board of directors. Ross joins the company as it prepares for the launch of the industry’s first commercial single chip CMOS photonics transceivers. Ross has more than 25 years of experience leading semiconductor companies through various stages of growth. Before joining Broadcom, he served as the President of Rockwell International's Telecommunications Group. Under Ross's leadership, Rockwell's semiconductor revenue grew from $140 million to more than $1 billion, and Rockwell became the worldwide leader in voice-band modems. He also held executive positions at National Semiconductor and Fairchild Semiconductor. “Lanny’s arrival couldn’t come at a better time. Just last month we announced the sampling of our high-performance 10 Gbps transceiver technology that integrates laser light sources and CMOS logic into a single chip solution,” said Alex Dickinson, co-founder, president and CEO of Luxtera. “We are the first company to make this technology a reality, and Lanny’s extraordinary skill set will be invaluable as we undergo rapid growth.” “Luxtera is really on the cutting-edge in the semiconductor industry,” said Ross. “They have a talented management team and a very strong board. I’m pleased to join them at this period of growth and development and look forward to helping them with the commercial launch of their innovative photonics technology.” Luxtera’s breakthrough technology integrates high-performance photonics and mainstream electronics on a single CMOS die, which along with an integrated laser brings fiber connectivity directly to the chip. Additional digital logic can be integrated into the same chip along with optical devices, further reducing overall solution size, power consumption and cost. The first application of this technology includes all logic equivalent to two complete XFP communication transceiver modules including TransImpedance Amplifiers (TIA), Mach-Zehnder modulators and Clock and Data Recovery (CDR) circuits. The company will launch a commercial transceiver product line based on this underlying technology in 2007 – years ahead of the competition. Future applications will extend to chip-to-chip and intra-chip optical connectivity.
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